Tesch grinding wheels are available in any basic bond types:
Resin bond, sintered metal bond, electroplated metal bond and vitrified bond.
Main properties of the bond types:
The function of the bond is to retain the diamond or CBN grain as long as it is able to perform the cutting operations. The bond wear and grain blunting must be adjusted so that the grain will be released in due time in order to preserve the chip spaces. If the specification has been chosen properly (size, bond, concentration), the grinding wheel is constantly ready to cut, i.e. it works in the range of self-sharpening.
Sintered metal bond
Electroplated metal bond
Certified according to DIN EN ISO 9001
Diamant-Gesellschaft Tesch GmbH
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