Tesch grinding wheels are available in any basic bond types:

Resin bond, sintered metal bond, electroplated metal bond and vitrified bond.

Main properties of the bond types:

       Resin bond

  • low grinding forces
  • wide range of adjustment
  • cool grinding

The function of the bond is to retain the diamond or CBN grain as long as it is able to perform the cutting operations. The bond wear and grain blunting must be adjusted so that the grain will be released in due time in order to preserve the chip spaces. If the specification has been chosen properly (size, bond, concentration), the grinding wheel is constantly ready to cut, i.e. it works in the range of self-sharpening. 

       Sintered metal bond

  • more wear-resistant than resin bonds
  • higher grinding forces and more grinding heat
  • suitable for profile grinding wheels
  • machining of workpieces, which have a strong abrasive effect on the bond

       Electroplated metal bond

  • material deposited on steel or aluminium base bodies through electroplating
  • grain tips can protrude up to half beyond the bond level (high chip space volume)
  • suitable for the coating of elaborately profiled base bodies

       Vitrified bond

  • pre-defined pore volume and different hardness
  • easy to dress
  • used for bore and internal cylindrical grinding, groove and form grinding as well as
    flat and cylindrical grinding
  • high workpiece accuracies due to the low grinding pressure

Bond Types

Certified according to DIN EN ISO 9001

Diamant-Gesellschaft Tesch GmbH

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